Semiconductor plastic packaging mold

The Plastic Seal mold is a high-precision mold with a dimensional accuracy of ±0.002mm. It uses multiple cryogenic treatments and high-temperature tempering to eliminate residual austenite and ensure dimensional stability. The product also has good mold clearability to improve the corrosion resistance of the cavity material, and some necessary surface treatments are used to improve mold clearability.

Semiconductor plastic molds are important tools for manufacturing semiconductor packages and are usually made of high-precision, high-hardness materials. In the semiconductor packaging process, plastic molds perform the functions of plastic sealing, demoulding and forming, and play an important role in ensuring the quality and accuracy of the packaging.

Since different types and specifications of semiconductor devices require different packaging molds, semiconductor plastic packaging molds can be divided into different types according to different classification standards. For example, according to the structural characteristics of the mold, semiconductor plastic packaging molds can be divided into flat-mounted molds and side-mounted molds; according to the materials used in the molds, they can be divided into metal molds and plastic molds.

Application

Electronics, communications, automotive, medical, etc.

Temperature characteristics

During molding, our operators control the temperature within a certain range to ensure the fluidity and molding effect of the plastic. In addition, the temperature distribution of the mold must be uniform to avoid molding defects and stress concentration caused by uneven temperature. At the same time, our company uses new heating and cooling technologies to improve the accuracy and stability of temperature control.

FAQS

Q:What is a semiconductor plastic mold?
A: Semiconductor plastic mold is an important tool for manufacturing semiconductor packaging. It is mainly used in integrated circuits, microelectronics, semiconductor packaging and other fields. In the semiconductor packaging process, plastic molds are used to encapsulate chips, circuits and other components in a plastic shell to improve their reliability and durability.

Q:What materials are used for plastic molds?
A: Commonly used materials include steel, carbide, ceramic, etc. These materials have the characteristics of high precision and high quality, which can ensure the accuracy and service life of the mold.

Q: How will the temperature characteristics of plastic molds affect production?
A: The temperature characteristics of plastic molds have an important impact on production. First, the working temperature of the mold must be controlled within a certain range to ensure the fluidity and molding effect of the plastic. Second, the temperature of the mold must be reached quickly and kept stable to improve production efficiency. In addition, the temperature distribution of the mold must be uniform to avoid molding defects and stress concentration caused by uneven temperatures. Therefore, when using and manufacturing plastic molds, our engineers fully consider and optimize their temperature characteristics.