Semiconductor plastic packaging mold product

Semiconductor plastic packaging mold is a mold used for plastic packaging of semiconductor devices. Its material and manufacturing process requirements are very high to ensure the accuracy and life of the mold. In the process of manufacturing semiconductor devices, plastic molds must withstand harsh environments such as high temperature, high pressure and corrosion, so they must have high strength, corrosion resistance, wear resistance and other properties.

Materials Used

The materials we use are: steel, carbide, ceramic, among which steel is the most commonly used material. During the manufacturing process, the process flow of semiconductor plastic mold includes rough machining, finishing, heat treatment and surface treatment. Each step requires strict control of quality and accuracy.

Stability

1) A high-precision mold with a dimensional accuracy within ±0.002mm, ensuring high dimensional stability.
2) Maintains its original performance after multiple uses, thereby extending the mold's service life.
3) In harsh environments such as high temperature, high pressure and corrosion, molds with good stability can maintain their performance without significant changes.
4) The product has high wear resistance.