China Semiconductor plastic packaging mold

Semiconductor plastic molds are molds used to package semiconductor devices and are typically made of metal or plastic materials. Packaging is a critical step in semiconductor manufacturing that helps protect semiconductor chips from the environment and provides electrical connections.

Our mold products are machined on high-precision CNC machine tools with very high dimensional accuracy and surface finish. In terms of materials, we select high-hardness, high-wear-resistant materials such as carbide and tungsten steel to ensure that they are not prone to wear and deformation during long-term use.

In the process design, we can customize the design and processing to meet the needs of different packaging processes. For example, it is necessary to design plastic molds of different specifications and sizes according to different chip sizes and circuit designs, etc.

Advantage

1) The use of high-precision processing technology can ensure the precision and dimensional accuracy of the mold.

2) It has a long service life and can be reused many times, which reduces production costs.

3) Made of high-hardness, corrosion-resistant materials, it can maintain good performance and stability in various environments.

4) Ensure that the manufactured semiconductor devices have high reliability and stability, improving product quality.